Inspection and Testing

3D Solder Paste Inspection plays an importment role on the quality control. Our quality policy is to detect problems at the early stage to reduce costly repair and avoid schedule delay. From our production data, over 90% defects were caused by the solder paste printing process. With 3D solder paste inspection process, we can control height / area / volume of the solder paste printing especially for tiny chip or fine pitch BGA.

Manual QC inspection is heavily replied on the skill and focus of the QC personnel, so the quality deviation is quit high. iTronix Systems has implemented AOI process to reduce manual QC inspection. Let QC personnel focus on some critical area which cannot be detected by AOI machine in order to increase the quality and reduce QC cost.

Since BGA device cannot be seen by QC operator, we use 2D / 3D X-Ray machine to inspect any short, open, cold solder, void. When board fails, we use x-ray machine to conduct detail failure analysis.

We offer variety of rework and repair services including BGA component removal / replacement / salvage, circuit pattern design changes at BGA, repair of lifted or missing BGA pads and repair of solder masks at BGA.

iTronix Systems' offers in-circuit test, flying probe test, boundary scan test, functional test and system functional test. We can provide turnkey test program development and test fixture fabrication services either.