Manufacturing Capabilities

iTronix Systems' offers the highest technical capabilities to meet the most demanding customer requirements for any types of circuit board assemblies. Our Sales, Application Layout / Design and Production Engineers will work closely with you to produce any type of BGA, Surface Mount or Through-Hole Technology and ensure we meet your requirements.

- 0201 Components
- Direct and multiple chip attach
- Double sided, mirrored BGA Assembly
- Double sided, single reflow processing
- Chip Scale Package (CSP)
- Optional splicing
- Fine pitch high count press fit connectors
- Flip chip and Lead-free-assembly
- Surface Mount Technology (SMT)
- MCMs, MEMs, Micro Connectors and uBGA
- Continuous flow SMT lines
- Pin Through Hole (PTH)
- Ball Grid Array (BGA)
- Miniature resistor and capacitor array
- Wave solder
- Selective soldering
- Inline cleaning

Contact us
321 E. Brokaw Road, San Jose CA 95112
Tel: (408)791-2690
Fax: (408)753-3537
Email: sales@itronixsystems.com
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